Description
MULTI SIZE: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes..NOT EASY TO DEFORM: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature..EASY TO CARRY: The stencil has a compact appearance and is easy to carry around and use..SATISFY DIFFERENT NEEDS: BGA stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs..EXCELLENT MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life..Industrial supplies, electrical electrical, electronic components, other electronic components
