| Editor: | Aditya Gupta |
| Preface by: | Fazal Ali |
| Author: | Gupta Ali |
| Format: | Hardcover: 392 pages. |
| Publisher: | Artech House Inc (02/01/1991) |
| ISBN: | 0890064016 |
| ISBN13: | 9780890064016 |
| Reading Level: |
| Preface | xi |
| Chapter 1 | HEMTs and HBTs: Introduction and Overview by Fazal Ali, Aditya Gupta | 1 |
| 1.1 | Introduction | 1 |
| 1.2 | High Electron Mobility Transistors (HEMTs) | 3 |
| 1.3 | Heterojunction Bipolar Transistors (HBTs) | 5 |
| 1.4 | Summary | 8 |
| Chapter 2 | HEMT Device Physics and Models by Mukunda B. Das | 11 |
| 2.1 | Introduction | 11 |
| 2.2 | Carrier Transport in the HEMT Structure | 13 |
| 2.2.1 | Band Diagram and 2-DEG in AlGaAs/GaAs Systems | 14 |
| 2.2.2 | 2-DEG Carrier Mobility and Saturation Velocity | 18 |
| 2.2.3 | 2-DEG Charge-Control by Schottky Barrier Gate | 22 |
| 2.2.4 | Ohmic Contacts and Series Resistances | 26 |
| 2.3 | The Charge-Control Model | 29 |
| 2.3.1 | dc and Small-Signal Characteristics | 29 |
| 2.3.2 | Temperature Stability of Device Operation | 36 |
| 2.3.3 | Low-Frequency (LF) Equivalent Network Model | 39 |
| 2.3.4 | The Unity-Current-Gain Frequency | 44 |
| 2.3.5 | Low-Frequency 1/f and g-r Noise Sources | 47 |
| 2.4 | High-Frequency (HF) Limitations | 51 |
| 2.4.1 | HF Equivalent Network for the Intrinsic HEMT | 52 |
| 2.4.2 | Determination of Equivalent Network Parameters | 57 |
| 2.4.3 | Power Gain and Stability | 61 |
| 2.4.4 | HF Noise Sources and Performance of HEMTs | 63 |
| Chapter 3 | HEMT Devices and Circuit Applications by P.C. Chao, Alan Swanson, April Brown, Umesh Mishra, Fazal Ali, Cindy Yuen | 77 |
| 3.1 | Introduction | 77 |
| 3.2 | GaAs-Based Conventional HEMT | 77 |
| 3.2.1 | Material Considerations | 79 |
| 3.2.2 | Device Fabrication | 84 |
| 3.2.3 | dc and RF Performance | 91 |
| 3.2.4 | Outlook | 99 |
| 3.3 | GaAs-Based Pseudomorphic HEMT | 103 |
| 3.3.1 | Material Structure | 103 |
| 3.3.2 | Applications of Pseudomorphic HEMTs | 111 |
| 3.4 | InP-Based Pseudomorphic HEMT | 123 |
| 3.4.1 | Introduction | 123 |
| 3.4.2 | Material Properties and Growth | 124 |
| 3.4.3 | Device Fabrication and Performance | 134 |
| 3.4.4 | Circuit Performance | 143 |
| 3.5 | HEMT Analog Circuit Applications | 148 |
| 3.5.1 | Introduction | 148 |
| 3.5.2 | HEMT Low-Noise Amplifiers | 148 |
| 3.5.3 | HEMT Wideband Amplifiers | 150 |
| 3.5.4 | HEMT Power Amplifiers | 159 |
| 3.5.5 | HEMT Control Circuits | 163 |
| 3.5.6 | HEMT Mixers and Converters | 168 |
| 3.5.7 | HEMT Oscillators | 174 |
| 3.5.8 | HEMT Frequency Doublers | 175 |
| 3.5.9 | Device Testing | 177 |
| 3.5.10 | Conclusion | 182 |
| 3.6 | HEMT Reliability | 184 |
| 3.6.1 | Reliability Testing of Low-Noise HEMTs | 184 |
| 3.6.2 | Reliability of Low-Noise HEMTs | 186 |
| 3.6.3 | Summary | 188 |
| Chapter 4 | HBT Device Physics and Models by Mukunda B. Das | 191 |
| 4.1 | Introduction | 191 |
| 4.2 | Carrier Transport in HBT Structures | 195 |
| 4.2.1 | Band Diagram and Current Transport | 196 |
| 4.2.2 | Recombination Processes | 200 |
| 4.2.3 | Drift, Diffusion, and Saturation Velocity | 202 |
| 4.2.4 | Ohmic Contacts and Series Resistances | 204 |
| 4.3 | The Charge-Control Model | 206 |
| 4.3.1 | dc and Small-Signal Characteristics | 207 |
| 4.3.2 | LF Equivalent Network Model and Unity Current Gain Frequency | 212 |
| 4.3.3 | The Switching Limitations | 215 |
| 4.3.4 | Low-Frequency 1/f Noise and g-r Noise Sources | 219 |
| 4.4 | High Frequency Limitations | 224 |
| 4.4.1 | HF Two-port Parameters and Equivalent Network Model | 224 |
| 4.4.2 | Determination of the Equivalent Network Parameters | 228 |
| 4.4.3 | Power Gain and Stability | 234 |
| 4.4.4 | HF Noise Sources and Noise Figures | 236 |
| 4.4.5 | Power Density Limitations of HBTs | 241 |
| 4.4.6 | Comparison of HBTs and HEMTs | 246 |
| Chapter 5 | HBT Devices and Circuit Applications by Michael E. Kim, Burhan Bayraktaroglu, Aditya Gupta | 253 |
| 5.1 | Introduction | 253 |
| 5.1.1 | Comparison with GaAs MESFET and HEMT | 257 |
| 5.1.2 | Comparison with Advanced Silicon Bipolar Transistor | 258 |
| 5.2 | Device Structure | 260 |
| 5.2.1 | Epitaxial Layer Growth | 266 |
| 5.2.2 | Emitter-up versus Collector-up | 269 |
| 5.3 | HBT Fabrication Technology | 270 |
| 5.3.1 | Self-Aligned Contacts | 274 |
| 5.3.2 | Planar Structures | 276 |
| 5.3.3 | Representative HBT IC Process | 278 |
| 5.4 | Technology Characterization | 281 |
| 5.4.1 | HBT dc Characteristics | 282 |
| 5.4.2 | HBT High-Frequency Characteristics | 286 |
| 5.4.3 | Intrinsic HBT Linearity | 287 |
| 5.4.4 | Intrinsic HBT Nonlinearity | 287 |
| 5.4.5 | HBT Noise Performance | 290 |
| 5.4.6 | Schottky Diode Characteristics | 291 |
| 5.4.7 | Thin-Film Resistors | 291 |
| 5.4.8 | Metal-Insulator-Metal (MIM) Capacitors | 292 |
| 5.4.9 | HBT Device Modeling and Simulation | 292 |
| 5.4.10 | Technology Qualification | 292 |
| 5.5 | Power HBT Design Considerations | 301 |
| 5.5.1 | Collector Design | 301 |
| 5.5.2 | Device Impedance | 302 |
| 5.5.3 | Size Considerations | 304 |
| 5.5.4 | Thermal Considerations | 307 |
| 5.5.5 | HBT Scaling | 311 |
| 5.5.6 | HBT Monolithic Amplifiers | 316 |
| 5.5.7 | HBT Complementary Amplifiers | 318 |
| 5.6 | Circuit Applications | 322 |
| 5.6.1 | Analog and Microwave Applications | 328 |
| 5.6.2 | Microwave Oscillators | 333 |
| 5.6.3 | Digital Applications | 341 |
| 5.6.4 | Analog-to-Digital Conversion Applications | 345 |
| 5.6.5 | Monolithically Combined Microwave-Digital Applications | 352 |
| 5.7 | InP-Based HBT | 354 |
| 5.8 | Reliability | 361 |
| Index | 371 |
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